Conventional rigid copper clad laminate

Copper clad laminate for automotive electronics

High-speed copper clad laminate

IC packaging LOW-CTE products

We are willing to sincerely cooperate with customers from all over the world and work together for a better future!

In order to meet the needs of market development, improve the core competitiveness of the enterprise and achieve the long-term development goals of the Company, the Company set up the R&D Center in 2020, with the R&D of high-speed and high-frequency copper clad laminates, packaging substrates, new technologies and new processes as its core tasks. The R&D Center has a usable area of 2,000 square meters, and has related equipment and instruments for experiment, analysis and detection, and pilot test of products. The R&D has 1 professor-level senior engineer, 3 project R&D engineers, 2 testing engineers and 5 laboratory personnel.