Conventional rigid copper clad laminate

Copper clad laminate for automotive electronics

High-speed copper clad laminate

IC packaging LOW-CTE products

We are willing to sincerely cooperate with customers from all over the world and work together for a better future!

In order to meet the needs of market development, improve the core competitiveness of the enterprise, and achieve the company's long-term development goals, the company established a research and development center in 2020, with the research and development of high-frequency and high-speed copper clad plates, packaging substrates, new technologies, and new processes as its core tasks. The R&D center has a practical area of 2000 square meters and is equipped with relevant equipment and instruments for experiments, analysis and testing, and product pilot testing. There are currently 2 professor level senior engineers, 3 project development engineers, 2 testing engineers, and 5 experimental personnel.