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High-grade copper clad laminate manufacturer

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CY-A30

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Description

◆ Features

Excellent thermalconductivity

Excellent BreakdowmVoltage

RoHScompliance

Excellent solder heat endurance

Excellent mechanicalproperties

Excellent electromagneticshielding

Canuseexternal coolingdevicedirectly

Highcost performance

◆ BasicStructure

 

CY-A30

SingleAl-Substrate CCL

CY-A30

 

SingleAl-Substrate CCL offers various kinds of combination of base metal,copper foil,and dielectric layerstomeetthegeneralrequirement ofsinglelayer thermalconductiveprintedcircuitboard

◆ Instruction

Circuit Layer –Electrolysis copper foil

Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance. Two types: Fiberglasssupport&non-fiberglass support.

Aluminum Substrate –It supports the entire structure and conducts the heat. The material is aluminum alloy plate

◆ Application

LEDlighting、Publiclighting、Backlightmodule、outdoorLEDdisplay

Automotive(Vehiclelighting、regulator、converters、Power module)

Industrial electronic(sDC-DCconverter、Powersupplies、Solid-StateRelaystransistormodules)

Digital、PC、Audio

Theareaneedshighheat dissipation

 

CY-A30

 

◆ Type

Normal. It is used widely in consumer lighting and backlight applications

General purpose. It is used widely in consumer lighting、outdoor LED display and backlight applications

Standard thermal conductivity. It is used in public lighting、Digital、PC、Audio、Automotive applications

High thermal conductivity. It is used in high power LED lighting、Automotive applications、Industrial electronics

High thermal conductivity、Low thermal resistance. It is used in high power applications

High toughness. It is used in the field of no-plat, with good bending properties.

◆ Mainproperty

Items

Test Method

Units

Spec

Typical Value

CY-A10

CY-A15

CY-A20

CY-A30

1.0W

1.5W

2.0W

3.0W

Insulating layer thickness

um

120±15

128.4

125.7

128.2

125.4

1OZ
Peel Strength

IPC-TM-650 2.4.8C

Lb/inch

≥ 8

10.15

9.87

10.23

10.21

Breakdown Voltage

IPC-TM-650 2.5.6.2

KV

≥ 3.0

4.2

4.5

4.3

4.5

Flammability

E-24/125

V-0

V-0

V-0

V-0

V-0

Arc Resistance

IPC-TM-650 2.5.1

S

≥ 60

150

150

150

150

Water Absorption

IPC-TM-650 2.6.6.1

%

≤0.50

0.25

0.22

0.27

0.23

Wrap & Twist

IPC-TM-650 2.5.5.1

%

≤1.0

0.54

0.52

0.63

0.52

Thermal  Conductivity

ASTM D5470

W/m.k

spe±10%

1.060

1.469

1.838

2.760

Thermal Resistance

ASTM D5470

℃/W

0.74

0.52

0.38

0.14

Glass Transition T

IPC-TM-650 2.4.25

100±10

92.3

93.8

95.3

92.5

Operating Temp

120±5

118

120

120

120

Solder float Resistance

IPC-TM-650 2.4.13

S

≥ 120

300℃ 180

300℃ 180

300℃ 180

300℃ 180

Permittivity at 1MHZ

IPC-TM-650 2.5.5.1

≤4.5

4.2

4.3

4.3

4.3

Loss Tangent at  1MHZ

IPC-TM-650 2.5.5.1

≤0.035

0.028

0.030

0.030

0.027

Surface  Resistance

IPC-TM-650 2.5.17.1

ohm

≥ 1.0×1013

10E+13

10E+13

10E+13

10E+13

Volume  Resistance

IPC-TM-650 2.5.17.1

Ohm.cm

≥ 1.0×1015

10E+15

10E+15

10E+15

10E+15

CTI

IEC60112

v

≥ 600

600

600

600

600

Halogen Content

EN14582

ppm

Cl,Br≤900

ND

ND

ND

ND

Cl+Br≤1500

ND

ND

ND

ND

 

◆ Aluminum brand and characteristics

Chemical properties

Aluminum grade

Si

Fe

Cu

Mn

Mg

Cr

Zn

Ti

Other

Al

Single

Total

1060

0.25

0.35

0.05

0.03

0.03

-

0.05

0.03

0.03

 

99.60%

5052

0.25

0.4

0.1

0.1

2.2-2.8

0.15-0.35

0.1

-

0.05

0.15

99.10%

Physical properties

Aluminum grade

Thermal performance

Electrical performance

Mechanical properties

Melting point range

Coefficient of expansion

Thermal conductivity

Specific heat capacity

Resistivity

Conductivity

Elongation

Tensile strength

Hardness

10-6K-1

w/m.K

J/kg-K

10-3uΩ-m

%IACS

%

KSI

HB

1060

645-655

23.6℃

230

 

 

 

4

95-135

12

5052

607-650

23.7℃

138

 

 

 

5

230-280

34

 

Specification

Standard Size

(500~700)mm×1100mm、(500~600)mm×1220mm                1000×1220mm、1100×1220mm

Circuit Layer
(Copper foil)

18μm、35μm、70μm、105μm
(Hoz、1oz、2oz、3oz)

Dielectric Layer Thickness

100μm、125μm、150μm(1.0~2.0 瓦) 100μm
(non-fiberglass support)

Thickness

0.6mm、0.8mm、1.0mm、1.2mm、1.5mm、1.6mm、2.0mm、 3.0mm(≤1.0 或 3oz 5052)

Aluminum Substrate Type

1060、5052 Anodization

Masking Film

PET、PI

 

Any specific require could be available upon request。

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