High-grade copper clad laminate manufacturer
Design, development, production, sales services
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HOT PRODUCT
◆Features
Halogen-free Tg≥170℃
Excellent peel strength
Excellent thermal resistance Td=380℃ T288=60min
Low Z-CTE 2.4%
Excellent in dimension stability
◆Applications
Mobile phone, Computer,Communication equipment ,Automotive electronics.
◆General properties
|
Item |
Unit |
TestCondition |
Spec |
TypicalValue |
|
|
Tg |
℃ |
DSC |
≥170 |
175 |
|
|
1oz PeelStrength |
N/mm |
288℃,10S |
≥1.05 |
1.43 |
|
|
Thermalstress |
S |
288℃,solderdip |
＞10 |
180s |
|
|
FlexuralStrength |
N/mm2 |
LW |
≥415 |
545 |
|
|
CW |
≥345 |
470 |
|||
|
Flammability |
－ |
E24/125 |
UL94V-0 |
V-0 |
|
|
SurfaceResistivity |
MΩ |
Aftermoisture |
≥1.0×104 |
5.20×107 |
|
|
VolumeResistivity |
MΩ·cm |
Aftermoisture |
≥1.0×106 |
5.10×108 |
|
|
DielectricConstant |
－ |
1MHZ |
≤5.4 |
4.5 |
|
|
LossTangent |
－ |
1MHZ |
≤0.035 |
0.013 |
|
|
ArcResistance |
S |
D48/50＋D0.5/23 |
≥60 |
120 |
|
|
DielectricBreakdown |
KV |
D48/50＋D0.5/23 |
≥40 |
57 |
|
|
MoistureAbsorption |
% |
D24/23 |
≤0.35 |
0.09 |
|
|
Td |
℃ |
Weight Loss5% |
≥325 |
380 |
|
|
T288 |
min |
TMA |
≥15 |
60 |
|
|
CTE |
Alpha1 |
ppm / ℃ |
TMA |
≤60 |
42 |
|
Alpha 2 |
ppm / ℃ |
≤300 |
240 |
||
|
50-260 ℃ |
% |
≤3.0 |
2.4 |
||
|
Halogen content |
Cl |
ppm |
EDX-GP |
≤900 |
310 |
|
Br |
ppm |
≤900 |
30 |
||
|
Cl+Br |
ppm |
≤1500 |
340 |
||
|
CTI |
V |
IEC-60112 |
175~250 |
200 |
|
SpecimenThickness:1.6mm ; Specificationsheet：IPC-4101C/130，isforyour referenceonly
Explanation:C:Humidityconditioning;D: Immersionconditioningindistilledwater;
E:Temperatureconditioning;
◆Purchasinginformation
|
Thickness |
Copper foil |
Standardsize |
|
0.10~3.2mm |
12um~105um |
37"×49"、41"×49"、43"×49" |
※Other sheet sizeandthicknesscouldbe available uponrequest