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High-grade copper clad laminate manufacturer

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CEM-3 - CY-C130HF

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Description

◆Features

Halogen-free product

Excellent mechanical processability, punching process applicable, longer drill bit life .

Electrical properties and PCB processing similar to FR-4.

◆Applications

Automotive electronics,apparatus and instrument,information household appliances,remote control unit,game machine,and etc.

◆General properties

Item

Unit

TestCondition

Spec

TypicalValue

Tg

DSC

≥120

128.5

1oz PeelStrength

N/mm

260℃,10S

≥1.05

1.54

Thermalstress

S

260℃,solderdip

>10

60 s

FlexuralStrength

N/mm2

LW

≥276

380

CW

≥186

300

Flammability

E24/125

UL94V-0

V-0

SurfaceResistivity

Aftermoisture

≥1.0×104

2.37×106

VolumeResistivity

MΩ·cm

Aftermoisture

≥1.0×106

2.67×108

DielectricConstant

1MHZ
C24/23/50

≤5.4

4.8

LossTangent

1MHZ
C24/23/50

≤0.035

0.016

ArcResistance

S

D48/50+D0.5/23

≥60

120

DielectricBreakdown

KV

D48/50+D0.5/23

≥40

55

MoistureAbsorption

 %

D24/23

≤0.5

0.17

Td

 ℃

Weight Loss5%

335

Halogen
content

Cl

ppm

EDX-GP

≤900

300

Br

ppm

≤900

30

Cl+Br

ppm

≤1500

330

T288

min

TMA

1

CTI

V

IEC-60112

 175~250

200

SpecimenThickness:1.6mm ; Specificationsheet:IPC-4101C/14,isforyour referenceonly

Explanation:C:Humidityconditioning;D: Immersionconditioningindistilledwater;

E:Temperatureconditioning;

◆Dielectric constant

 

Dielectric constant

 

Dimensional change in cross and length direction after heat treatment

 

Dielectric constant

 

◆Purchasinginformation

Thickness

Copper foil

Standardsize

0.10~3.2mm

12um~105um

37"×49"、41"×49"、43"×49"

※Other sheet sizeandthicknesscouldbe available uponrequest

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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