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High-grade copper clad laminate manufacturer

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FR-4 - CY-L150D/F

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Description

◆特Features

(Dk≤3.8,1GHz) Low Dk (Dk≤3.8,1GHz)

(Df≤0.009,1GHz) Low loss (Df≤0.009,1GHz)

Low Z-CTE

Anti-CAF

Excellent thermal resistance

◆Applications

Backplanes, card board, high-frequency servers, switches, antennas, base station products.

◆General properties

Item

Unit

TestCondition

Spec

TypicalValue

Tg

DSC

≥150

155

1oz PeelStrength

N/mm

288℃,10S

≥0.7

1.05

Thermalstress

S

288℃,solderdip

>10

180s
Nodelamination

FlexuralStrength

N/mm2

LW

≥415

490

CW

≥345

440

Flammability

E24/125

UL94V-0

V-0

SurfaceResistivity

Aftermoisture

≥1.0×104

3.54×108

VolumeResistivity

MΩ·cm

Aftermoisture

≥1.0×106

4.25×108

DielectricConstant

1MHZ
C24/23/50

≤5.2

3.8

LossTangent

1MHZ
C24/23/50

≤0.035

0.009

ArcResistance

S

D48/50+D0.5/23

≥60

122

DielectricBreakdown

KV

D48/50+D0.5/23

≥40

58

MoistureAbsorption

 %

D24/23

≤0.35

0.10

Td

 ℃

Weight Loss5%

≥325

345

CTE Z-axis

Alpha1

ppm / ℃

TMA

≤60

52

Alpha 2

ppm / ℃

≤300

260

50-260 ℃

%

≤3.5

3.2

T288

min

TMA

≥15

30

SpecimenThickness:1.6mm ; Specificationsheet:IPC-4101C/126,isforyour referenceonly

Explanation:C:Humidityconditioning;D: Immersionconditioningindistilledwater;

E:Temperatureconditioning;

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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