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High-grade copper clad laminate manufacturer

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FR-4 - CY-L170

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Description

◆Features

Tg≥170℃ (DSC)

ExcellentAnti-CAFresistance

ExcellentT/H reliability

LowZ-CTE 2.9%

Td=347℃,T288=30min High thermalperformanceTd=347℃ ,T288=30min

Excellentindimensionstability

◆Applications

Suitableforhigh-countlayer PCB,computer,communicationequipment,Automotiveelectronics,

◆主General properties

Item

Unit

TestCondition

Spec

TypicalValue

Tg

DSC

≥170

175

1oz PeelStrength

N/mm

288℃,10S

≥1.05

1.41

Thermalstress

S

288℃,solderdip

>10

180s
Nodelamination

FlexuralStrength

N/mm2

LW

≥415

580

CW

≥345

482

Flammability

E24/125

UL94V-0

V-0

SurfaceResistivity

Aftermoisture

≥1.0×104

2.55×107

VolumeResistivity

MΩ·cm

Aftermoisture

≥1.0×106

3.25×108

DielectricConstant

1MHZ
C24/23/50

≤5.4

4.7

LossTangent

1MHZ
C24/23/50

≤0.035

0.016

ArcResistance

S

D48/50+D0.5/23

≥60

122

DielectricBreakdown

KV

D48/50+D0.5/23

≥40

58

MoistureAbsorption

 %

D24/23

≤0.35

0.10

Td

 ℃

Weight Loss5%

≥325

345

CTE Z-axis

Alpha1

ppm / ℃

TMA

≤60

45

Alpha 2

ppm / ℃

≤300

270

50-260 ℃

%

≤3.5

2.9

T288

min

TMA

≥5

30

CTI

V

IEC-60112

 175~250

200

SpecimenThickness:1.6mm ; Specificationsheet:IPC-4101C/126,isforyour referenceonly

Explanation:C:Humidityconditioning;D: Immersionconditioningindistilledwater;

E:Temperatureconditioning;

◆ExcellentThermal Resistancs

 

ExcellentThermal Resistancs

 

Pre-Treatment: 125℃/2hourintheoven

◆ExcelentAnti-CAFPerformance

 

ExcelentAnti-CAFPerformance

 

Specimen:Backset:0.65mm,Aperture:0.3mm,DC50V/85℃/85%RH

◆Purchasinginformation

Thickness

Copper foil

Standardsize

0.10~3.2mm

12um~105um

37"×49"、41"×49"、43"×49"

※Other sheet sizeandthicknesscouldbe available uponrequest

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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