High-grade copper clad laminate manufacturer
Design, development, production, sales services
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HOT PRODUCT
◆Features
Tg≥145℃ (DSC)
UVBlockingandAOI compatible,soastoincreaseproductivity efficiency
High thermal performance，Td ≥325℃ ,T288≥5min，suitableforlead-freeprocess。
◆Applications
Computer,communicationequipment,Automotiveelectronics.
◆General properties
|
Item |
Unit |
TestCondition |
Spec |
TypicalValue |
|
|
Tg |
℃ |
DSC |
≥145 |
145.5 |
|
|
1oz PeelStrength |
N/mm |
288℃,10S |
≥1.05 |
1.31 |
|
|
Thermalstress |
S |
288℃,solderdip |
＞10 |
120s |
|
|
FlexuralStrength |
N/mm2 |
LW |
≥415 |
570 |
|
|
CW |
≥345 |
485 |
|||
|
Flammability |
－ |
E24/125 |
UL94V-0 |
V-0 |
|
|
SurfaceResistivity |
MΩ |
Aftermoisture |
≥1.0×104 |
5.16×107 |
|
|
VolumeResistivity |
MΩ·cm |
Aftermoisture |
≥1.0×106 |
5.06×108 |
|
|
DielectricConstant |
－ |
1MHZ |
≤5.4 |
4.8 |
|
|
LossTangent |
－ |
1MHZ |
≤0.035 |
0.018 |
|
|
ArcResistance |
S |
D48/50＋D0.5/23 |
≥60 |
125 |
|
|
DielectricBreakdown |
KV |
D48/50＋D0.5/23 |
≥40 |
57 |
|
|
MoistureAbsorption |
% |
D24/23 |
≤0.35 |
0.10 |
|
|
Td |
℃ |
Weight Loss5% |
≥325 |
340 |
|
|
CTE Z-axis |
Alpha1 |
ppm / ℃ |
TMA |
≤60 |
46 |
|
Alpha 2 |
ppm / ℃ |
≤300 |
260 |
||
|
50-260 ℃ |
% |
≤3.5 |
3.8 |
||
|
T288 |
min |
TMA |
≥5 |
20 |
|
|
CTI |
V |
IEC-60112 |
175~250 |
200 |
|
SpecimenThickness:1.6mm ; Specificationsheet：IPC-4101C/99，is foryour referenceonly
Explanation:C: Humidityconditioning; D: Immersionconditioningindistilledwater;
E:Temperatureconditioning;
◆ExcellentThermal Resistancs
Pre-Treatment: 125℃/2hourintheoven
Thermal shockcondition：-40℃(30min)～+125℃(30min),transfertime<2min
◆ExcelentAnti-CAFPerformance
Specimen：Backset：0.65mm,Aperture：0.3mm,DC50V/85℃/85%RH
◆Purchasinginformation
|
Thickness |
Copper foil |
Standardsize |
|
0.10~3.2mm |
12um~105um |
37"×49"、41"×49"、43"×49" |
※Other sheet sizeandthicknesscouldbe available uponrequest