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High-grade copper clad laminate manufacturer

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FR-4 - CY-F140

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Description

◆Features

Tg:135±5℃(DSC)

UVBlockingandAOIcompatible,soas toincreaseproductivityefficiency

According tonecessity toprovideadielectricconstant:4.3± 0.3(1 MHZ)of FR-4plate

◆Applications

Suitablefor medium multilayer printedcircuit board,computer, communicationequipment,OAequipment,etc.

◆Generalproperties

Item

Unit

TestCondition

Spec

TypicalValue

Tg

DSC

135±5

135.5

1oz PeelStrength

N/mm

288℃,10S

≥1.40

1.81

Thermalstress

S

288℃,solderdip

>10

120s
Nodelamination

FlexuralStrength

N/mm2

LW

≥415

580

CW

≥345

580

Flammability

E24/125

UL94V-0

V-0

SurfaceResistivity

Aftermoisture

≥1.0×104

5.16×107

VolumeResistivity

MΩ·cm

Aftermoisture

≥1.0×106

5.07×108

DielectricConstant

1MHZ
C24/23/50

≤5.4

4.8

LossTangent

1MHZ
C24/23/50

≤0.035

0.015

ArcResistance

S

D48/50+D0.5/23

≥60

125

DielectricBreakdown

KV

D48/50+D0.5/23

≥40

58

MoistureAbsorption

 %

D24/23

≤0.35

0.15

Td

 ℃

Weight Loss5%

310

CTE Z-axis

Alpha1

ppm / ℃

 

TMA

60

Alpha 2

ppm / ℃

300

50-260 ℃

%

4.3

T288

min

TMA

2

CTI

V

IEC-60112

 175~250

200

 ≥600

 600

◆Dielectricconstant

Dielectricconstant

Dimensionalchangeincrossand lengthdirectionafterheattreatment

Dielectricconstant

◆Purchasinginformation

Thickness

Copper foil

Standardsize

0.10~3.2mm

12um~105um

37"×49"、41"×49"、43"×49"

※Other sheet sizeandthicknesscouldbe available uponrequest

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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FR-4 - CY-F140