High-grade copper clad laminate manufacturer
Design, development, production, sales services
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HOT PRODUCT
◆Features
Excellent thermalconductivity
Excellent BreakdowmVoltage
RoHScompliance
Excellent solder heat endurance
Excellent mechanicalproperties
Excellent electromagneticshielding
Canuseexternal coolingdevicedirectly
Highcost performance
◆BasicStructure
singleAl-Substrate CCL
SingleAl-Substrate CCL offers various kinds of combination of base metal,copper foil,and dielectric layerstomeetthegeneralrequirement ofsinglelayer thermalconductiveprintedcircuitboard
◆Instruction
Circuit Layer –Electrolysis copper foil
Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance. Two types: Fiberglasssupport&non-fiberglass support.
Aluminum Substrate –It supports the entire structure and conducts the heat. The material is aluminum alloy plate
◆Application
LEDlighting、Publiclighting、Backlightmodule、outdoorLEDdisplay
Automotive(Vehiclelighting、regulator、converters、Power module)
Industrial electronic(sDC-DCconverter、Powersupplies、Solid-StateRelaystransistormodules)
Digital、PC、Audio
Theareaneedshighheat dissipation
◆Type
Normal. It is used widely in consumer lighting and backlight applications
General purpose. It is used widely in consumer lighting、outdoor LED display and backlight applications
Standard thermal conductivity. It is used in public lighting、Digital、PC、Audio、Automotive applications
High thermal conductivity. It is used in high power LED lighting、Automotive applications、Industrial electronics
High thermal conductivity、Low thermal resistance. It is used in high power applications
High toughness. It is used in the field of no-plat, with good bending properties.
◆Mainproperty
|
Items |
Test Method |
Units |
Spec |
Typical Value |
|||
|
CY-A10 |
CY-A15 |
CY-A20 |
CY-A30 |
||||
|
1.0W |
1.5W |
2.0W |
3.0W |
||||
|
Insulating layer thickness |
— |
um |
120±15 |
128.4 |
125.7 |
128.2 |
125.4 |
|
1OZ Peel Strength |
IPC-TM-650 2.4.8C |
Lb/inch |
≥ 8 |
10.15 |
9.87 |
10.23 |
10.21 |
|
Breakdown Voltage |
IPC-TM-650 2.5.6.2 |
KV |
≥ 3.0 |
4.2 |
4.5 |
4.3 |
4.5 |
|
Flammability |
E-24/125 |
— |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
|
Arc Resistance |
IPC-TM-650 2.5.1 |
S |
≥ 60 |
150 |
150 |
150 |
150 |
|
Water Absorption |
IPC-TM-650 2.6.6.1 |
% |
≤0.50 |
0.25 |
0.22 |
0.27 |
0.23 |
|
Wrap & Twist |
IPC-TM-650 2.5.5.1 |
% |
≤1.0 |
0.54 |
0.52 |
0.63 |
0.52 |
|
Thermal Conductivity |
ASTM D5470 |
W/m.k |
spe±10% |
1.060 |
1.469 |
1.838 |
2.760 |
|
Thermal Resistance |
ASTM D5470 |
℃/W |
— |
0.74 |
0.52 |
0.38 |
0.14 |
|
Glass Transition T |
IPC-TM-650 2.4.25 |
℃ |
100±10 |
92.3 |
93.8 |
95.3 |
92.5 |
|
Operating Temp |
— |
℃ |
120±5 |
118 |
120 |
120 |
120 |
|
Solder float Resistance |
IPC-TM-650 2.4.13 |
S |
≥ 120 |
300℃ 180 |
300℃ 180 |
300℃ 180 |
300℃ 180 |
|
Permittivity at 1MHZ |
IPC-TM-650 2.5.5.1 |
— |
≤4.5 |
4.2 |
4.3 |
4.3 |
4.3 |
|
Loss Tangent at 1MHZ |
IPC-TM-650 2.5.5.1 |
— |
≤0.035 |
0.028 |
0.030 |
0.030 |
0.027 |
|
Surface Resistance |
IPC-TM-650 2.5.17.1 |
ohm |
≥ 1.0×1013 |
10E+13 |
10E+13 |
10E+13 |
10E+13 |
|
Volume Resistance |
IPC-TM-650 2.5.17.1 |
Ohm.cm |
≥ 1.0×1015 |
10E+15 |
10E+15 |
10E+15 |
10E+15 |
|
CTI |
IEC60112 |
v |
≥ 600 |
600 |
600 |
600 |
600 |
|
Halogen Content |
EN14582 |
ppm |
Cl，Br≤900 |
ND |
ND |
ND |
ND |
|
Cl+Br≤1500 |
ND |
ND |
ND |
ND |
|||
◆Aluminum brand and characteristics
Chemical properties
|
Aluminum grades |
Si |
Fe |
Cu |
Mn |
Mg |
Cr |
Zn |
Ti |
Other elements |
Al |
|
|
Single |
Total |
||||||||||
|
1060 |
0.25 |
0.35 |
0.05 |
0.03 |
0.03 |
- |
0.05 |
0.03 |
0.03 |
|
99.60% |
|
5052 |
0.25 |
0.4 |
0.1 |
0.1 |
2.2-2.8 |
0.15-0.35 |
0.1 |
- |
0.05 |
0.15 |
99.10% |
Physical properties
|
Aluminum grades |
Thermal performance |
Electrical performance |
Mechanical properties |
||||||
|
Melting range |
Coefficient of expansion |
Thermal conductivity |
Specific heat capacity |
Resistivity |
Conductivity |
Elongation |
Tensile strength |
Hardness |
|
|
℃ |
10-6K-1 |
w/m.K |
J/kg-K |
10-3uΩ-m |
%IACS |
% |
KSI |
HB |
|
|
1060 |
645-655 |
23.6℃ |
230 |
|
|
|
4 |
95-135 |
12 |
|
5052 |
607-650 |
23.7℃ |
138 |
|
|
|
5 |
230-280 |
34 |
◆Specification
|
Standard Size |
(500~700)mm×1100mm、(500~600)mm×1220mm 1000×1220mm、1100×1220mm |
|
Circuit Layer |
18μm、35μm、70μm、105μm |
|
Dielectric Layer Thickness |
100μm、125μm、150μm（1.0~2.0 瓦） 100μm |
|
铝Thickness |
0.6mm、0.8mm、1.0mm、1.2mm、1.5mm、1.6mm、2.0mm、 3.0mm（≤1.0 或 3oz Copper foil recommended aluminum type 5052） |
|
Aluminum Substrate Type |
1060、5052 |
|
Masking Film |
PET、PI |
Any specific require could be available upon request。