CY-S600
Category：
Key words：
Copper clad laminate series
Product D etails
◆ Characteristics
● Hgih Tg：≥200℃（DSC），Halogen-free
● Low dielectric constant (Dk：3.6, 10GHz)
● Low dielectric loss (Df:0.004510GHz)
● Excellent thermal performance，Td≥370℃
● Low Z-axis thermal expansion coefficient
● Good CAF resistance and high reliability
● Lead-free process compatibility
◆ Application area
Mobile phones, computers, backplanes, card boards, switches, servers, thick copper products, and automotive electronics
◆ Main characteristics
|
Item |
Unit |
TestCondition |
Spec |
TypicalValue |
|
|
Tg |
℃ |
DSC |
≥200 |
205 |
|
|
1oz(RTF)PeelStrength |
lb/in |
A |
4～7 |
5 |
|
|
Thermalstress |
S |
288℃,solderdip |
＞60 |
300 s |
|
|
FlexuralStrength |
N/mm2 |
LW |
≥415 |
515 |
|
|
CW |
≥345 |
445 |
|||
|
Flammability |
－ |
E24/125 |
UL94V-0 |
V-0 |
|
|
SurfaceResistivity |
MΩ |
C-96/35/90 |
≥1.0×104 |
1×108 |
|
|
VolumeResistivity |
MΩ·cm |
C-96/35/90 |
≥1.0×106 |
1×1010 |
|
|
DielectricConstant |
－ |
1GHz 2GHz 5GHz 10GHz |
N/A |
3.8 3.7 3.7 3.6 |
|
|
LossTangent |
－ |
1GHz 2GHz 5GHz 10GHz |
N/A |
0.003 0.0035 0.004 0.0045 |
|
|
ArcResistance |
S |
D48/50＋D0.5/23 |
≥60 |
146 |
|
|
DielectricBreakdown |
KV |
D48/50＋D0.5/23 |
≥50 |
50 |
|
|
MoistureAbsorption |
% |
D24/23 |
≤0.8 |
0.15 |
|
|
Td |
℃ |
Weight Loss5% |
— |
370 |
|
|
CTE
|
X-Y axis |
ppm / ℃ |
TMA |
— |
9/12 |
|
Alpha 1 |
ppm / ℃ |
— |
45 |
||
|
Alpha 2 |
ppm / ℃ |
— |
245 |
||
|
50-260Degrees C |
% |
- |
2.3 |
||
|
T260 |
min |
TMA |
＞60 |
＞60 |
|
|
T288 |
min |
TMA |
30 |
＞30 |
|
|
Dimensional Stability |
% |
IPC-TM650 |
<0.05 |
0.03 |
|
1.Attribute values are for reference only and are not used for specification.
2.Any sale of these products will be subject to the terms and conditions of the sale agreement.
Related products
Suitable for 2-6 layer PCB, computer and peripheral equipment, communication equipment, office automation equipment, etc.
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