CY-F180HF
Key words:
Copper clad laminate series
Mobile phones, computers, communication equipment, and automotive electronics
Product D etails
◆ Characteristics
● High Tg:≥170℃
● Excellent peel strength
● Excellent heat resistance Td=380℃, T288=60min
● Excellent dimensional stability
● Low Z-axis thermal expansion coefficient
◆ Application area
Mobile phones, computers, communication equipment, and automotive electronics
◆ Main characteristics
Related products
Suitable for 2-6 layer PCB, computer and peripheral equipment, communication equipment, office automation equipment, etc.
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