CY-F150HF
Category:
Key words:
Copper clad laminate series
Mobile phones, computers, communication equipment, instruments, cameras, televisions, etc.
Product D etails
◆ Characteristics
● High Tg: ≥150℃
● Dicyandiamide curing, excellent peel strength
● Excellent heat resistance Td=358 ℃ T288=30min
● Low Z-axis thermal expansion coefficient
◆ Application area
Mobile phones, computers, communication equipment, instruments, cameras, televisions, etc.
◆ Main characteristics
Related products
Suitable for 2-6 layer PCB, computer and peripheral equipment, communication equipment, office automation equipment, etc.
MESSAGE