CY-HT270-D40
Key words：
Copper clad laminate series
Product D etails
◆ Characteristics
● High Tg：≥270℃（DSC），Halogen-free
● Low dielectric constant (Dk≤4.0, 10GHz)
● Low dielectric loss (Df≤0.006 10GHz)
● Excellent thermal performance，Td≥410℃
● Low Z-axis thermal expansion coefficient
● Good CAF resistance and high reliability
● Lead-free process compatibility
◆ Application area
It can be used in high-speed transmission and signal fidelity applications, packaging and loading plates, high-temperature radomes, antennas, aerospace structures, missile structures and space applications and other military and civil fields
◆ Main characteristics
|
Items |
Method |
Condition |
Unit |
Typical Value |
|
Tg |
IPC-TM-650 2.4.25 |
DSC |
℃ |
271 |
|
Tg |
IPC-TM-650 2.4.24 |
TMA |
℃ |
250 |
|
CTE |
IPC-TM-650 2.4.24 |
50-320℃ |
% |
2.4 |
|
Td |
IPC-TM-650 2.4.24.6 |
5% wt. loss |
℃ |
410 |
|
T300 |
IPC-TM-650 2.4.24.1 |
TMA |
min |
15 |
|
Thermal Stress |
IPC-TM-650 2.4.13.1 |
288℃, solder dip |
min |
10 |
|
Dissipation Constant (Dk) |
IPC-TM-650 2.5.5.9 |
1GHz |
-- |
---- |
|
IPC-TM-6502.5.5.5 |
10GHz |
-- |
4.0 |
|
|
IEC 61189-2-721 |
10GHz |
-- |
4.3 |
|
|
Dissipation Factor (Df) |
IPC-TM-650 2.5.5.9 |
1GHz |
-- |
---- |
|
IPC-TM-6502.5.5.5 |
10GHz |
-- |
0.005 |
|
|
IEC 61189-2-721 |
10GHz |
-- |
0.0061 |
|
|
Volume Resistivity |
2.5.17.1 |
After moisture resistance |
Ω.cm |
1.1 x 1017 |
|
Surface Resistivity |
2.5.17.1 |
After moisture resistance |
Ω |
9.0 x1016 |
|
Arc Resistance |
2.5.1 |
D-48/50+D-0.5/23 |
s |
130 |
|
Dielectric Breakdown |
2.5.6 |
D-48/50+D-0.5/23 |
kV/mm |
>20 |
|
Peel Strength (1oz ) |
2.4.8 |
After thermal Stress 288℃,10s |
N/mm |
1.70 |
|
Water Absorption |
2.6.2.1 |
E-1/105+D-24/23 |
% |
0.18 |
|
Flammability |
UL94 |
C-48/23/50, E-24/125 |
Rating |
V-0 |
1.Attribute values are for reference only and are not used for specification.
2.Any sale of these products will be subject to the terms and conditions of the sale agreement.
Related products
Suitable for 2-6 layer PCB, computer and peripheral equipment, communication equipment, office automation equipment, etc.
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