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Copper clad laminate series
Conventional rigid copper clad laminate
Ordinary/Halogen
Lead-free/Halogen
Halogen-free
Copper clad laminate for automotive electronics
High-speed copper clad laminate
IC packaging LOW-CTE products
Aluminum-based high thermal conductivity products
Prepreg series
CY-L150P
Storage conditions: 3 months at temperature ≤23℃ and humidity ≤50%; 6 months at temperature ≤5℃ and under sealing condition.
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CY-L180P